1.27 mm Pitch Castellated Module Footprint and DFM Guide

1.27 mm-pitch castellated module edge is a module edge package used for board edge assembly, also seen labeled 0.05-inch castellations, 1.27 mm half-hole module. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Defined by module outline, overall span Includes module body, overhang, and antenna keepout, seated height Module PCB and populated component height, pitch 1.27 mm, pin count Variable edge-pad count, and exposed pad Plated routed half holes.

Follow the exact module pad center, half-hole diameter, board thickness, and recommended parent land pattern.

Typical uses include radio modules, microcontroller modules, compact daughterboards. 1.27 mm pitch is only the grid; module edge, thickness, hole, and parent-land details come from the module vendor.

• The 1.27 mm grid offers more mask margin than 1.00 mm but still needs a controlled relationship between plated hole, routed edge, and annulus.
• Castellations are a board-to-board interconnect process, not just half pads drawn on an outline; pitch, edge plating, hole breakout, and module thickness must be agreed with the fab.

Model the whole module, keep copper out of underside and antenna zones, and use parent lands that expose a side toe without excessive paste.

• Keep the parent-board lands accessible for side fillets, route module signals inward, and preserve antenna, component, and enclosure keepouts beyond the module body.

Hand assembly is rated hard. Stencil reflow; careful drag solder for accessible prototype rework. Watch for edge misregistration, pin-one rotation, and insufficient visible fillet.

• Confirm castellated routing, panel tabs, edge copper, and inspection requirements with the module fab and assembly house.
• Confirm castellated-hole diameter, minimum pitch, routing method, and whether burr removal or edge copper is included in the quoted service.
• Panelize so routed edges are supported without tabs crossing the plated half holes, and add fiducials suitable for module placement.

Inspection focus:

• Inspect each side fillet, board seating, and orientation, then verify every edge interface and RF or sensor function.
• Inspect every side fillet, module coplanarity, edge burrs, and solder bridges; then test each interface because a visually small void can open a castellation.

Common mistakes:

• A correct pin grid with the module outline shifted half a pitch can leave one edge row hanging off its parent lands.
• Do not place ordinary plated holes on Edge.Cuts and assume every fabricator will turn them into clean castellations automatically.

1. Before approving 1.27 mm-pitch castellated module edge, compare the exact orderable-device drawing with the library item: body range (Defined by module outline), terminal or lead span (Includes module body, overhang, and antenna keepout), pitch (1.27 mm), pin count (Variable edge-pad count), height (Module PCB and populated component height), and exposed-pad definition (Plated routed half holes). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the hard hand-solder rating as a prototype-planning input, not proof of production yield. Review edge misregistration, pin-one rotation, and insufficient visible fillet with the assembler, confirm that stencil reflow; careful drag solder for accessible prototype rework is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Module outline origin, both edge rows, pin-one, half-hole breakout, keepouts, and parent pad overlap need geometric checks.
2. S1Castellated-hole breakout and edge geometry. The routed outline must bisect the plated holes as intended without leaving an ambiguous or unmanufacturable board edge.
3. S2Courtyard and body clearance. The body, leads, placement tolerance, rework access, and nearby height limits all belong in the manufacturing review.