2.00 mm Pitch Castellated Module Footprint and DFM Guide

2.00 mm-pitch castellated module edge is a module edge package used for board edge assembly, also seen labeled 2 mm castellations, 2 mm half-hole module. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Defined by module drawing, overall span Complete module plus overhang and keepouts, seated height Module and highest fitted component, pitch 2.00 mm, pin count Variable edge-pad count, and exposed pad Plated half holes on routed edge.

Use the module's exact edge-hole diameter, PCB thickness, outline origin, and recommended parent footprint.

Typical uses include ESP and radio modules, GNSS modules, embedded controllers. A 2.00 mm castellation grid does not standardize module pinout, hole diameter, outline, or antenna constraints.

• Two-millimeter pitch usually allows distinct mask dams and visible fillets, but module outline and underside pads can still make a generic grid unsafe.
• Castellations are a board-to-board interconnect process, not just half pads drawn on an outline; pitch, edge plating, hole breakout, and module thickness must be agreed with the fab.

Place the module at the intended board edge if its antenna requires it, maintain all keepouts, and provide short, low-impedance power and ground connections.

• Keep the parent-board lands accessible for side fillets, route module signals inward, and preserve antenna, component, and enclosure keepouts beyond the module body.

Hand assembly is rated moderate. Stencil reflow or accessible hand solder with flux. Watch for module rotation, antenna copper beneath the module, and weak side fillets.

• Specify castellated edges explicitly in fabrication notes and panelize without tabs or V-scores crossing the plated holes.
• Confirm castellated-hole diameter, minimum pitch, routing method, and whether burr removal or edge copper is included in the quoted service.
• Panelize so routed edges are supported without tabs crossing the plated half holes, and add fiducials suitable for module placement.

Inspection focus:

• Inspect edge plating and all side fillets, then test power integrity, programming, every used interface, and RF performance where applicable.
• Inspect every side fillet, module coplanarity, edge burrs, and solder bridges; then test each interface because a visually small void can open a castellation.

Common mistakes:

• Adding a ground pour under a module's PCB antenna can severely detune it even though every castellation is soldered correctly.
• Do not place ordinary plated holes on Edge.Cuts and assume every fabricator will turn them into clean castellations automatically.

1. Before approving 2.00 mm-pitch castellated module edge, compare the exact orderable-device drawing with the library item: body range (Defined by module drawing), terminal or lead span (Complete module plus overhang and keepouts), pitch (2.00 mm), pin count (Variable edge-pad count), height (Module and highest fitted component), and exposed-pad definition (Plated half holes on routed edge). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the moderate hand-solder rating as a prototype-planning input, not proof of production yield. Review module rotation, antenna copper beneath the module, and weak side fillets with the assembler, confirm that stencil reflow or accessible hand solder with flux is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. The gate must include antenna keepout, module orientation, all castellation nets, edge geometry, and parent-pad overlap.
2. S1Castellated-hole breakout and edge geometry. The routed outline must bisect the plated holes as intended without leaving an ambiguous or unmanufacturable board edge.
3. S2Courtyard and body clearance. The body, leads, placement tolerance, rework access, and nearby height limits all belong in the manufacturing review.