makeIRLPCB engineering field guide

Package footprints & DFM

1.00 mm Pitch Castellated Module Footprint and DFM Guide

Design a 1.00 mm-pitch castellated module edge with fab-approved half holes, parent-board lands, paste and fillet access, panel routing, coplanarity, and AOI.

Practical PCB integration · KiCad 9 · Manufacturing gate

Get the exact 1.00 mm-pitch castellated module edge land pattern right before routing

1.00 mm-pitch castellated module edge is a module edge package used for board edge assembly, also seen labeled 1 mm castellations, fine-pitch half-hole module. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Defined by the module outline, overall span Parent footprint includes the complete module and keepouts, seated height Module stack plus components, pitch 1.00 mm, pin count Variable edge-pad count, and exposed pad Plated half holes along routed module edge.

Use the module maker's land pattern and a fabricator-confirmed castellated-hole process; hole diameter and edge breakout are linked.

Typical uses include compact radio modules, wearable submodules, sensor modules. Fine-pitch castellations are custom PCB geometry; module drawing and written fab capability replace a generic package standard.

Package1.00 mm-pitch castellated module edge
Aliases1 mm castellations, fine-pitch half-hole module
Familymodule-edge
Mountingboard-edge
BodyDefined by the module outline
OverallParent footprint includes the complete module and keepouts
HeightModule stack plus components
Pitch1.00 mm
PinsVariable edge-pad count
Exposed padPlated half holes along routed module edge

Geometry, layout, and hand-solder reality

  • At 1.00 mm pitch, hole diameter and copper annulus consume most of each cell, leaving little mask dam or routing margin.
  • Castellations are a board-to-board interconnect process, not just half pads drawn on an outline; pitch, edge plating, hole breakout, and module thickness must be agreed with the fab.

Extend parent pads enough for inspectable side fillets, keep vias and traces away from adjacent pads, and honor antenna or underside keepouts.

  • Keep the parent-board lands accessible for side fillets, route module signals inward, and preserve antenna, component, and enclosure keepouts beyond the module body.

Hand assembly is rated expert-only. Stencil and reflow with accurate module placement. Watch for mask slivers, edge burrs, bridging, and fab refusal at fine pitch.

DFM, inspection, and common mistakes

  • Get explicit capability confirmation for 1.00 mm castellation pitch, routed-edge quality, mask registration, and panel support.
  • Confirm castellated-hole diameter, minimum pitch, routing method, and whether burr removal or edge copper is included in the quoted service.
  • Panelize so routed edges are supported without tabs crossing the plated half holes, and add fiducials suitable for module placement.

Inspection focus:

  • Inspect every side fillet at magnification, check module coplanarity and edge burrs, then test all interface pins and any radio path.
  • Inspect every side fillet, module coplanarity, edge burrs, and solder bridges; then test each interface because a visually small void can open a castellation.

Common mistakes:

  • Using 1 mm castellations with a default mask expansion can merge every opening and invite solder bridges along the module edge.
  • Do not place ordinary plated holes on Edge.Cuts and assume every fabricator will turn them into clean castellations automatically.

Selection checklist and gate checks for 1.00 mm-pitch castellated module edge

  1. Before approving 1.00 mm-pitch castellated module edge, compare the exact orderable-device drawing with the library item: body range (Defined by the module outline), terminal or lead span (Parent footprint includes the complete module and keepouts), pitch (1.00 mm), pin count (Variable edge-pad count), height (Module stack plus components), and exposed-pad definition (Plated half holes along routed module edge). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
  2. Treat the expert-only hand-solder rating as a prototype-planning input, not proof of production yield. Review mask slivers, edge burrs, bridging, and fab refusal at fine pitch with the assembler, confirm that stencil and reflow with accurate module placement is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

  1. S1Pad count, numbering, and schematic parity. Pitch, hole breakout, edge route, mask web, parent-pad clearance, module orientation, and all edge-pin nets are critical.
  2. S1Castellated-hole breakout and edge geometry. The routed outline must bisect the plated holes as intended without leaving an ambiguous or unmanufacturable board edge.
  3. S2Courtyard and body clearance. The body, leads, placement tolerance, rework access, and nearby height limits all belong in the manufacturing review.

Check the design before fabrication

Run the release gate and inspect the 1.00 mm-pitch castellated module edge footprint before fabrication.

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