2.00 mm Right-Angle Dual-Row Header Footprint Practical Guide

2.00 mm 2×N right-angle pin header is a through hole package used for through hole assembly, also seen labeled 2 mm right-angle dual header, 2×N RA P2.00. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Series-specific dual-row insulator, overall span Includes bend reach and horizontal mating posts, seated height Mating-axis height is drawing-specific, pitch 2.00 mm within and between rows, pin count Variable 2×N array, and exposed pad Plated through-hole annuli.

Use the selected right-angle series drawing, including hole grid, insulator setback, bend radius, and horizontal post length.

Typical uses include board-edge modules, compact cable interfaces, debug fixtures. Right-angle reach and axis height are connector-series properties even when the through-hole grid is 2.00 mm.

• Two bent rows occupy different heights and mechanical sweeps; the footprint's courtyard must model more than the through-hole grid.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Check plug insertion, cable exit, enclosure wall, and board-edge projection in 3D, and add mechanical support for repeated mating cycles.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated moderate. Use a fixture that holds both rows parallel to the PCB edge during soldering. Watch for bend-offset errors, row twist, and edge collisions.

• Fixture both axis height and squareness, preserve solder access, and avoid tabs or panel rails that block the projecting connector.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Measure mating-axis height and row coplanarity, inspect every barrel, and mate the production cable inside the enclosure.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• Substituting a vertical 2×N footprint ignores the right-angle insulator setback and can bury the connector behind the PCB edge.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving 2.00 mm 2×N right-angle pin header, compare the exact orderable-device drawing with the library item: body range (Series-specific dual-row insulator), terminal or lead span (Includes bend reach and horizontal mating posts), pitch (2.00 mm within and between rows), pin count (Variable 2×N array), height (Mating-axis height is drawing-specific), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the moderate hand-solder rating as a prototype-planning input, not proof of production yield. Review bend-offset errors, row twist, and edge collisions with the assembler, confirm that use a fixture that holds both rows parallel to the pcb edge during soldering is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Both rows, bend geometry, board-edge keepout, hole tolerances, pin map, and mating envelope require mechanical parity.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.