2.00 mm Dual-Row Pin Header Footprint and DFM Practical Guide

2.00 mm 2×N vertical pin header is a through hole package used for through hole assembly, also seen labeled 2 mm dual-row header, 2×N P2.00, compact board-stack header. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Often about 4.0 mm wide; length depends on N, overall span Housing and post height are series-specific, seated height Varies with stacking or cable use, pitch 2.00 mm within and between rows, pin count Variable 2×N array, and exposed pad Plated through-hole annuli.

Use one selected series for post, row spacing, insulator, and mating socket; a grid alone is not a complete connector definition.

Typical uses include compact mezzanines, embedded modules, dense debug headers. A 2.00 mm grid is common across several non-intermateable series; cross-section and housing data control selection.

• Two 2.00 mm rows form a compact grid with less routing room and less tolerance between plated holes than a 2.54 mm array.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Map the mating view explicitly, reserve socket sidewalls and board-stack separation, and allocate power pins with suitable current and return partners.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated moderate. Fixture-assisted hand or wave soldering. Watch for row reversal, small annular rings, and incompatible mating height.

• Review minimum copper between annuli, finished-hole tolerance, long-row alignment, and solder-process access between the two rows.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Inspect both rows for fill and straightness, then mate the intended socket or mezzanine across the full pin count.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• Using a footprint with 2.00 mm column pitch but 2.54 mm row spacing creates a distorted array that may escape a quick visual review.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving 2.00 mm 2×N vertical pin header, compare the exact orderable-device drawing with the library item: body range (Often about 4.0 mm wide; length depends on N), terminal or lead span (Housing and post height are series-specific), pitch (2.00 mm within and between rows), pin count (Variable 2×N array), height (Varies with stacking or cable use), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the moderate hand-solder rating as a prototype-planning input, not proof of production yield. Review row reversal, small annular rings, and incompatible mating height with the assembler, confirm that fixture-assisted hand or wave soldering is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Both pitch axes, view-dependent pin numbering, finished holes, connector height, and mating part number need explicit checks.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.