Package footprints & DFM
2.00 mm Single-Row Pin Header Footprint and DFM Practical Guide
Lay out a vertical 2.00 mm single-row header with smaller post and hole tolerances, correct annular rings, mating height, pin-one marking, and assembly access.
Practical PCB integration · KiCad 9 · Manufacturing gate
Get the exact 2.00 mm 1×N vertical pin header land pattern right before routing
2.00 mm 1×N vertical pin header is a through hole package used for through hole assembly, also seen labeled 2 mm pitch header, single-row micro header, 1×N P2.00. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Typically about 2.0 mm wide; length depends on positions, overall span Post and mating lengths are series-specific, seated height Common insulators near 2 mm plus posts, pitch 2.00 mm, pin count Variable 1×N row, and exposed pad Plated through-hole annuli.
Use the actual post diagonal and recommended finished hole; 2 mm series commonly use smaller posts than 0.1-inch headers.
Typical uses include compact modules, programming ports, small board stacks. 2.00 mm pitch does not define post cross-section or mating height; use one compatible connector series.
| Package | 2.00 mm 1×N vertical pin header |
|---|---|
| Aliases | 2 mm pitch header, single-row micro header, 1×N P2.00 |
| Family | through-hole |
| Mounting | through-hole |
| Body | Typically about 2.0 mm wide; length depends on positions |
| Overall | Post and mating lengths are series-specific |
| Height | Common insulators near 2 mm plus posts |
| Pitch | 2.00 mm |
| Pins | Variable 1×N row |
| Exposed pad | Plated through-hole annuli |
Geometry, layout, and hand-solder reality
- A 2.00 mm pitch saves about 21% row length versus 2.54 mm but leaves less copper between adjacent holes for routing and annular tolerance.
- The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.
Reserve the matching socket body and verify stack height; do not assume common 2.54 mm jumpers or breadboards can mate.
- Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.
Hand assembly is rated moderate. Fine-tip hand solder or fixture-assisted wave solder. Watch for confusing 2.00 with 2.54 mm, tight annular rings, and bent small posts.
DFM, inspection, and common mistakes
- Check drill registration and the copper web between adjacent annuli, especially when traces try to pass through a long header row.
- Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
- Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.
Inspection focus:
- Inspect post straightness, seating, and barrel fill, then mate the exact 2.00 mm socket without side load.
- Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.
Common mistakes:
- A mislabeled 2.54 mm cable may seem close enough in CAD but cannot mate with a 2.00 mm production header.
- Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.
Selection checklist and gate checks for 2.00 mm 1×N vertical pin header
- Before approving 2.00 mm 1×N vertical pin header, compare the exact orderable-device drawing with the library item: body range (Typically about 2.0 mm wide; length depends on positions), terminal or lead span (Post and mating lengths are series-specific), pitch (2.00 mm), pin count (Variable 1×N row), height (Common insulators near 2 mm plus posts), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
- Treat the moderate hand-solder rating as a prototype-planning input, not proof of production yield. Review confusing 2.00 with 2.54 mm, tight annular rings, and bent small posts with the assembler, confirm that fine-tip hand solder or fixture-assisted wave solder is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.
Manufacturing gate checks:
- S1Pad count, numbering, and schematic parity. The gate should compare pitch numerically, post size, finished hole, annular ring, row length, and mating-series identity.
- S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
- S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.
Check the design before fabrication
Run the release gate and inspect the 2.00 mm 1×N vertical pin header footprint before fabrication.
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