DIP-8 7.62 mm Footprint: Dimensions, Drills, and Assembly

DIP-8 7.62 mm row spacing is a through hole package used for through hole assembly, also seen labeled 300-mil DIP-8, PDIP-8, 8-pin dual-inline. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body About 9.3 × 6.4 mm, overall span 7.62 mm nominal row spacing; leads may spring wider, seated height Typically 3.3–5.1 mm without socket, pitch 2.54 mm along rows, pin count 8; 4 per row, and exposed pad Plated through-hole annuli.

Use the exact PDIP body, 7.62 mm row spacing, lead form, and recommended hole; sockets can need larger courtyard and holes.

Typical uses include op-amps, timers, socketed prototypes. This page covers common 300-mil/7.62 mm PDIP-8; body, lead form, socket, and hole tolerances are part-specific.

• Four leads per row sit on a 2.54 mm grid while the molded body's formed leads may arrive wider than 7.62 mm and require gentle insertion.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Mark pin one and notch visibly, reserve extraction space for a socketed IC, and place bypassing close to supply pins despite the broad body.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated easy. Hand or wave solder, often with a socket for replaceable ICs. Watch for 300/600-mil confusion, lead spring, and reversed notch orientation.

• Choose thermal relief for reliable barrel fill, keep silkscreen out of pads, and distinguish socket versus direct-solder BOM options.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Inspect all eight barrels, notch orientation, bent-under leads, and socket seating; then verify power pins before inserting the IC.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• Forcing a 600-mil wide DIP or socket into a 300-mil footprint bends leads and can create intermittent barrel contact.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving DIP-8 7.62 mm row spacing, compare the exact orderable-device drawing with the library item: body range (About 9.3 × 6.4 mm), terminal or lead span (7.62 mm nominal row spacing; leads may spring wider), pitch (2.54 mm along rows), pin count (8; 4 per row), height (Typically 3.3–5.1 mm without socket), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the easy hand-solder rating as a prototype-planning input, not proof of production yield. Review 300/600-mil confusion, lead spring, and reversed notch orientation with the assembler, confirm that hand or wave solder, often with a socket for replaceable ics is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Row spacing, eight-pin map, notch, finished holes, socket option, and all power connections must match the exact part.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.