DIP-14 7.62 mm Footprint: Dimensions, Drills, Assembly Guide

DIP-14 7.62 mm row spacing is a through hole package used for through hole assembly, also seen labeled 300-mil DIP-14, PDIP-14, 14-pin dual-inline. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body About 19.2 × 6.4 mm, overall span 7.62 mm nominal row spacing, seated height Typically 3.3–5.1 mm without socket, pitch 2.54 mm along rows, pin count 14; 7 per row, and exposed pad Plated through-hole annuli.

Use the exact 14-pin body length, 7.62 mm row spacing, lead tolerance, and socket dimensions.

Typical uses include logic ICs, quad op-amps, educational boards. DIP-14 is commonly 7.62 mm wide at 2.54 mm pitch; exact body, lead, and socket drawings control fit.

• Seven leads per row make the body roughly twice DIP-8 length; pitch error or a bowed socket becomes visible at the end pins.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Keep bypassing at the actual supply pins and leave room to lever a socketed part out without striking adjacent components.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated easy. Hand or wave solder; socket when replacement or thermal isolation matters. Watch for end-lead misalignment, hidden power pins, and a reversed socket notch.

• Fixture long sockets flat, balance plane thermal relief across power pins, and keep assembly text from obscuring pin-one markings.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Check first and last pins for alignment, inspect all barrels, verify the notch, and confirm hidden power pins before fitting the device.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• A multi-unit logic or op-amp symbol can omit the power unit from review while the physical DIP-14 footprint looks complete.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving DIP-14 7.62 mm row spacing, compare the exact orderable-device drawing with the library item: body range (About 19.2 × 6.4 mm), terminal or lead span (7.62 mm nominal row spacing), pitch (2.54 mm along rows), pin count (14; 7 per row), height (Typically 3.3–5.1 mm without socket), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the easy hand-solder rating as a prototype-planning input, not proof of production yield. Review end-lead misalignment, hidden power pins, and a reversed socket notch with the assembler, confirm that hand or wave solder; socket when replacement or thermal isolation matters is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Fourteen pads, hidden supply units, row spacing, notch direction, hole size, and socket choice need parity checks.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.