DIP-16 7.62 mm Footprint: Dimensions, Drills, Assembly Guide

DIP-16 7.62 mm row spacing is a through hole package used for through hole assembly, also seen labeled 300-mil DIP-16, PDIP-16, 16-pin dual-inline. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body About 19.2–20.0 × 6.4 mm, overall span 7.62 mm nominal row spacing, seated height Typically 3.3–5.1 mm without socket, pitch 2.54 mm along rows, pin count 16; 8 per row, and exposed pad Plated through-hole annuli.

Use the exact body length, row span, formed-lead dimensions, and chosen socket's tail geometry.

Typical uses include logic arrays, drivers, legacy converters. This covers 300-mil DIP-16; some 16-pin packages and sockets use other widths or lead forms.

• Eight leads per side span 17.78 mm between the first and last centers; small pitch or fixture errors accumulate along the row.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Route repeated channels systematically, distribute ground and supply copper, and leave a clear extraction path for socketed parts.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated easy. Hand or wave solder, optionally using a 16-pin socket. Watch for long-body skew, mirrored numbering, and undersized socket holes.

• Keep long sockets seated during soldering, verify uniform barrel fill, and account for their larger body and height in the courtyard.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Inspect end alignment and all sixteen joints, verify notch direction, then exercise every output or channel under representative load.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• Numbering a DIP clockwise from the PCB bottom instead of counterclockwise from the top view mirrors all sixteen connections.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving DIP-16 7.62 mm row spacing, compare the exact orderable-device drawing with the library item: body range (About 19.2–20.0 × 6.4 mm), terminal or lead span (7.62 mm nominal row spacing), pitch (2.54 mm along rows), pin count (16; 8 per row), height (Typically 3.3–5.1 mm without socket), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the easy hand-solder rating as a prototype-planning input, not proof of production yield. Review long-body skew, mirrored numbering, and undersized socket holes with the assembler, confirm that hand or wave solder, optionally using a 16-pin socket is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Top-view pin convention, sixteen-pad map, row spacing, socket geometry, finished holes, and supply nets must agree.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.