DIP-28 15.24 mm Footprint: Dimensions, Drills, Assembly

DIP-28 15.24 mm row spacing is a through hole package used for through hole assembly, also seen labeled 600-mil DIP-28, wide PDIP-28, 28-pin dual-inline. A dependable footprint follows the exact orderable-device drawing rather than the family name: nominal body Often about 35–38 × 14 mm, overall span 15.24 mm nominal row spacing, seated height Typically 3.5–5.5 mm without socket, pitch 2.54 mm along rows, pin count 28; 14 per row, and exposed pad Plated through-hole annuli.

Use the exact 600-mil body, 15.24 mm rows, lead form, and socket drawing; some DIP-28 devices use 7.62 mm rows.

Typical uses include legacy MCUs, EPROMs, retro-computing interfaces. DIP-28 exists in narrow and wide bodies; this page specifically covers the 15.24 mm/600-mil form.

• Fourteen leads per row and a body over 35 mm long make width and length variants impossible to treat as a generic DIP-28.
• The finished hole must fit the lead at maximum material condition plus insertion tolerance and plating; the drill file normally specifies the pre-plating tool size.

Reserve removal space and a clear notch, place decouplers at supply pins, and route wide buses without cutting the ground return into long slots.

• Reserve the full connector or component envelope on both sides, include mating and wire-entry space, and keep copper clear of hardware and hand-tool access.

Hand assembly is rated easy. Socketed hand or wave soldering with a flat fixture. Watch for 300/600-mil width error, long socket bow, and bent-under inner leads.

• Fixture the long socket against bow, use uniform thermal relief, and ensure panel flex does not lift end pins before solder solidifies.
• Choose annular rings from the fabricator's registration allowance and confirm whether slots, press-fit holes, or non-plated features need separate drill outputs.
• Account for wave or selective solder orientation, pallet access, thermal spokes, and bottom-side protrusion before panel release.

Inspection focus:

• Inspect all twenty-eight barrels and socket seating, look for leads folded under the body, then verify the full address/data or I/O bus.
• Inspect barrel fill, wetting around the lead, polarity, seating, and mechanical alignment; continuity alone does not prove a durable connector joint.

Common mistakes:

• Choosing the common-looking 600-mil footprint for a narrow 300-mil DIP-28 makes the exact purchased IC or socket unusable.
• Do not use nominal lead width as the finished-hole size or forget that plating reduces the hole after drilling.

1. Before approving DIP-28 15.24 mm row spacing, compare the exact orderable-device drawing with the library item: body range (Often about 35–38 × 14 mm), terminal or lead span (15.24 mm nominal row spacing), pitch (2.54 mm along rows), pin count (28; 14 per row), height (Typically 3.5–5.5 mm without socket), and exposed-pad definition (Plated through-hole annuli). Record the source drawing revision and every intentional courtyard, toe, heel, side, mask, or paste adjustment.
2. Treat the easy hand-solder rating as a prototype-planning input, not proof of production yield. Review 300/600-mil width error, long socket bow, and bent-under inner leads with the assembler, confirm that socketed hand or wave soldering with a flat fixture is compatible with the build, and require the S1 connectivity gate plus relevant S2 geometry checks to pass against the released footprint and selected fabrication profile.

Manufacturing gate checks:

1. S1Pad count, numbering, and schematic parity. Row width, twenty-eight pin map, body length, socket MPN, hole size, notch, and every bus net require parity review.
2. S2Finished-hole tolerance and annular ring. The lead must insert after plating while retaining enough copper for registration, solder fill, and mechanical load.
3. S2Finished-hole size and annular ring. Drill, plating, lead tolerance, and the remaining annular ring must agree with the fab capability.